Infrastructure
The building is part of the compute system.
We engineer and operate power, direct-to-chip cooling, network fabric, and Vera Rubin compute as one stack. Deployment regions and capacity are matched privately to each workload.
AI infrastructure
Accelerated Compute Facilities
High-density facilities engineered around Vera Rubin systems, direct-to-chip warm-water cooling, and low-latency fabrics for training and inference.
02Dedicated deployments
Private AI Infrastructure
Isolated compute environments for companies that need predictable capacity, private networking, and a deployment shaped around their operating model.
03Managed infrastructure
Data Center Operations
The complete physical layer—resilient power, direct-to-chip cooling, network fabric, telemetry, maintenance, and capacity planning—operated by one accountable team.
Infrastructure design envelope
Designed for the thermal and power profile of modern AI systems.
100 kW+
per-rack density capability
30–35°C
warm-water DTC loop
120 kW
CDU thermal design
1.12
annualized PUE design target
These figures describe the infrastructure design envelope and targets. Actual deployment specifications depend on the selected site, system configuration, and operating requirements.